docs/wiki/geda-pcb_footprint_naming_conventions.html

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  14 <em>Translations of this page are also available in the following languages:</em> <a href="geda-pcb_footprint_naming_conventions.ru.html" class="wikilink1" title="geda-pcb_footprint_naming_conventions.ru.html">Русский</a>.
  15 </p>
  16
  17 <h2 class="sectionedit1" id="footprint_naming_conventions">Footprint naming conventions</h2>
  18 <div class="level2">
  19
  20 <p>
  21 This section describes the conventions for naming of footprints used in PCB (and gEDA/gaf).<br/>
  22
  23 The purpose of the naming convention is to establish a standard to maintain the same naming convention through the different phases of the CAD chain. This helps in ensuring that the collaborative effort of gEDA/gaf is not lost.
  24 </p>
  25
  26 </div>
  27 <!-- EDIT1 SECTION "Footprint naming conventions" [135-498] -->
  28 <h3 class="sectionedit2" id="notes">Notes</h3>
  29 <div class="level3">
  30 <ul>
  31 <li class="level1"><div class="li"> Unless otherwise noted, numerical pin names will be used, starting from 1.</div>
  32 </li>
  33 <li class="level1"><div class="li"> n is for the pin count.</div>
  34 </li>
  35 <li class="level1"><div class="li"> m is for the pin spacing in mils.</div>
  36 </li>
  37 <li class="level1"><div class="li"> x is for the x dimension of the package (excluding pins). In particular this is used for the QFP package family.</div>
  38 </li>
  39 <li class="level1"><div class="li"> SMT means surface mount, other components are through-hole.</div>
  40 </li>
  41 </ul>
  42
  43 </div>
  44 <!-- EDIT2 SECTION "Notes" [499-841] -->
  45 <h3 class="sectionedit3" id="integrated_circuit_packages">Integrated circuit packages</h3>
  46 <div class="level3">
  47 <ul>
  48 <li class="level1"><div class="li"> Dual in line packages with up to 22 100 mil spaced pins and 300 mil row spacing are called DIPn.</div>
  49 </li>
  50 <li class="level1"><div class="li"> Dual in line packages with 24 or more 100 mil spaced pins and 300 mil row spacing are called DIPnN.</div>
  51 </li>
  52 <li class="level1"><div class="li"> Dual in line packages with 100 mil spaced pins and 400 mil row spacing are called DIPnH.</div>
  53 </li>
  54 <li class="level1"><div class="li"> Dual in line packages with 24 or more 100 mil spaced pins and 600 mil row spacing are called DIPn.</div>
  55 </li>
  56 <li class="level1"><div class="li"> Shrink dual in line packages with up to 24 70 mil spaced pins and 300 mil row spacing are called SDIPn.</div>
  57 </li>
  58 <li class="level1"><div class="li"> Shrink dual in line packages with more than 24 70 mil spaced pins and 400 mil row spacing are called SDIPn.</div>
  59 </li>
  60 <li class="level1"><div class="li"> Single in line packages with 100 mil spaced pins are called SIPnN. See also JUMPER, below.</div>
  61 </li>
  62 <li class="level1"><div class="li"> Zig-zag in-line package are called ZIPn.</div>
  63 </li>
  64 <li class="level1"><div class="li"> Plastic leadless chip carrier with pin socket are called PLCCnX.</div>
  65 </li>
  66 </ul>
  67
  68 </div>
  69 <!-- EDIT3 SECTION "Integrated circuit packages" [842-1710] -->
  70 <h3 class="sectionedit4" id="integrated_circuit_smt_packages">Integrated circuit SMT packages</h3>
  71 <div class="level3">
  72 <ul>
  73 <li class="level1"><div class="li"> Small outline SMT packages with up to 16 50 mil spaced pins and 150 mil total width are called SOn.</div>
  74 </li>
  75 <li class="level1"><div class="li"> Small outline SMT packages with more than 16 50 mil spaced pins and 150 mil total width are called SOnN.</div>
  76 </li>
  77 <li class="level1"><div class="li"> Small outline SMT packages with 50 mil spaced pins and 200 mil total width are called SOnM.</div>
  78 </li>
  79 <li class="level1"><div class="li"> Small outline SMT packages with up to 20 50 mil spaced pins and 300 mil total width are called SOnW.</div>
  80 </li>
  81 <li class="level1"><div class="li"> Small outline SMT packages with more than 20 50 mil spaced pins and 300 mil total width are called SOn.</div>
  82 </li>
  83 <li class="level1"><div class="li"> Small outline SMT packages with 44 or more 50 mil spaced pins and 525 mil total width are called SOn.</div>
  84 </li>
  85 <li class="level1"><div class="li"> Metric shrink small outline SMT packages with 0.65 mm spaced pins and 323 mil total width are called MSSOPn. NOTE: To be confirmed.</div>
  86 </li>
  87 <li class="level1"><div class="li"> Metric shrink small outline SMT packages with up to 44 0.65 mm spaced pins and 420 mil total width are called MSSOPnW.</div>
  88 </li>
  89 <li class="level1"><div class="li"> Metric shrink small outline SMT packages with over 44 0.65 mm spaced pins and 545 mil total width are called MSSOPnW.</div>
  90 </li>
  91 <li class="level1"><div class="li"> Shrink small outline SMT packages with 25 mil spaced pins and 420 mil total width are called SSOPnW.</div>
  92 </li>
  93 <li class="level1"><div class="li"> Quarter size small outline SMT packages with 25 mil spaced pins and 244 mil total width are called SSOPn.</div>
  94 </li>
  95 <li class="level1"><div class="li"> Thin small outline SMT packages with 21.65 mil spaced pins and 535 mil total width are called TSOPn.</div>
  96 </li>
  97 <li class="level1"><div class="li"> Thin small outline SMT packages with 20 mil spaced pins and 795 mil total width are called TSOPnA.</div>
  98 </li>
  99 <li class="level1"><div class="li"> Thin small outline SMT packages with 20 mil spaced pins and 559 mil total width are called TSOPnB.</div>
 100 </li>
 101 <li class="level1"><div class="li"> Thin shrink small outline SMT packages with up to 28 26 mil spaced pins and 260 mil total width are called TSSOPn.</div>
 102 </li>
 103 <li class="level1"><div class="li"> Thin shrink small outline SMT packages with over 28 20 mil spaced pins and 319 mil total width are called TSSOPn.</div>
 104 </li>
 105 <li class="level1"><div class="li"> Ultra Super Mini SMT packages with up to 16 0.5 mm spaced pins are called USn.</div>
 106 </li>
 107 <li class="level1"><div class="li"> Plastic leadless chip carrier SMT are called PLCCn.</div>
 108 </li>
 109 <li class="level1"><div class="li"> Square quad-side at pack SMT are called QFPn x.</div>
 110 </li>
 111 <li class="level1"><div class="li"> Rectangular quad-side at pack SMT are called QFPn R.</div>
 112 </li>
 113 <li class="level1"><div class="li"> Square low profile quad-side at pack SMT are called LQFPn x.</div>
 114 </li>
 115 <li class="level1"><div class="li"> Square thin quad-side at pack SMT are called TQFPn x.</div>
 116 </li>
 117 <li class="level1"><div class="li"> Square Quad-side at no-lead SMT without exposed paddle (back side contact) are called QFNn x. Pin count is n and package size is x mm.</div>
 118 </li>
 119 <li class="level1"><div class="li"> Square Quad-side at no-lead SMT with exposed paddle (back side contact) are called QFNn x EP. Pin count is n and package size is x mm.</div>
 120 </li>
 121 <li class="level1"><div class="li"> Thin profile square Quad-side at no-lead SMT without exposed paddle (back side contact) are called TQFNn x. Pin count is n and package size is x mm.</div>
 122 </li>
 123 <li class="level1"><div class="li"> Thin profile square Quad-side at no-lead SMT with exposed paddle (back side contact) are called TQFNn x EP. Pin count is n and package size is x mm.</div>
 124 </li>
 125 <li class="level1"><div class="li"> Dual in line style crystal oscillators are OSC8 and OSC14.</div>
 126 </li>
 127 <li class="level1"><div class="li"> 5 pin SOT SMT packages are SOT25 and SOT325.</div>
 128 </li>
 129 <li class="level1"><div class="li"> 6 pin SOT SMT packages are SOT26 and SOT326.</div>
 130 </li>
 131 </ul>
 132
 133 </div>
 134 <!-- EDIT4 SECTION "Integrated circuit SMT packages" [1711-4641] -->
 135 <h3 class="sectionedit5" id="basic_semiconductors">Basic semiconductors</h3>
 136 <div class="level3">
 137 <ul>
 138 <li class="level1"><div class="li"> Axial diodes are called ALFm. Pin 1 is the cathode.</div>
 139 </li>
 140 <li class="level1"><div class="li"> Conventional through hole LED is LED3 and LED5 for 3 and 5 mm respectively. Pin 1 is plus. NOTE: Should probably be changed to be in line with diode convention.</div>
 141 </li>
 142 <li class="level1"><div class="li"> TO transistors are TO5, TO92, TO126, TO220 etc. Su\x0exes may apply, e.g. TO126W is for wide, TO126S is for standing, TO126SW is for standing, wide.</div>
 143 </li>
 144 </ul>
 145
 146 </div>
 147 <!-- EDIT5 SECTION "Basic semiconductors" [4642-5044] -->
 148 <h3 class="sectionedit6" id="basic_smt_semiconductors">Basic SMT semiconductors</h3>
 149 <div class="level3">
 150 <ul>
 151 <li class="level1"><div class="li"> SOD diode SMT packages use their standard package name, e.g. SOD80, SOD87, SOD106A, SOD110. There are also SOD123, SOD323 with narrow pads.</div>
 152 </li>
 153 <li class="level1"><div class="li"> SOT transistor SMT packages use their standard package name, e.g. SOT23, SOT323. There is also an SC90.</div>
 154 </li>
 155 <li class="level1"><div class="li"> SOT transistor SMT packages with numbering as for diodes (pin 1 is cathode, pin 2 anode) are SOT23D, SOT323D.</div>
 156 </li>
 157 <li class="level1"><div class="li"> 4 pin SOT SMT packages are SOT89, SOT143, SOT223.</div>
 158 </li>
 159 </ul>
 160
 161 </div>
 162 <!-- EDIT6 SECTION "Basic SMT semiconductors" [5045-5500] -->
 163 <h3 class="sectionedit7" id="passive_components">Passive components</h3>
 164 <div class="level3">
 165 <ul>
 166 <li class="level1"><div class="li"> Axial non-polar components (typically resistor, capacitor) are called ACYm.</div>
 167 </li>
 168 <li class="level1"><div class="li"> Bottom lead (radial) non-polar circular component (typically capacitor) is RCYm.</div>
 169 </li>
 170 <li class="level1"><div class="li"> Bottom lead non-polar rectangular component (typically capacitor) is BREm.</div>
 171 </li>
 172 <li class="level1"><div class="li"> A standard crystal is HC49, or other HC designations as required.</div>
 173 </li>
 174 <li class="level1"><div class="li"> Single row 100 mil pin spacing jumpers are JUMPERn. The main difference compared to single in line package is the hole size.</div>
 175 </li>
 176 <li class="level1"><div class="li"> Dual row 100 mil spacing headers with DIP pin numbering are HEADERn 1. Note that n is an even number.</div>
 177 </li>
 178 <li class="level1"><div class="li"> Dual row 100 mil spacing headers with ribbon cable numbering are HEADERn 2. Note that n is an even number.</div>
 179 </li>
 180 <li class="level1"><div class="li"> Angled full header connectors with latches are DIN41651 n.</div>
 181 </li>
 182 <li class="level1"><div class="li"> Standing full header connectors with latches are DIN41651 nS.</div>
 183 </li>
 184 <li class="level1"><div class="li"> DSUB connectors female are DBnF.</div>
 185 </li>
 186 <li class="level1"><div class="li"> DSUB connectors male are DBnM.</div>
 187 </li>
 188 <li class="level1"><div class="li"> Female DIN card-to-card connectors are DIN41612CnF. Add S suffix for standing.</div>
 189 </li>
 190 <li class="level1"><div class="li"> Male DIN card-to-card connectors are DIN41612CnM. Add S suffix for standing.</div>
 191 </li>
 192 <li class="level1"><div class="li"> AMP modular RJ connectors with screen are RJ11, RJ12 and RJ45.</div>
 193 </li>
 194 </ul>
 195
 196 </div>
 197 <!-- EDIT7 SECTION "Passive components" [5501-6622] -->
 198 <h3 class="sectionedit8" id="passive_smt_components">Passive SMT components</h3>
 199 <div class="level3">
 200 <ul>
 201 <li class="level1"><div class="li"> Standard SMT resistors, inductors, capacitors etc are 0201, 0402, 0603, 0805, 1206, 1210, 1806, 1812, 1825, 2020, 2706.</div>
 202 </li>
 203 <li class="level1"><div class="li"> Tantalum SMT capacitors are EIA3216, EIA3528, EIA6032, and EIA7343. Pin 1 is plus.</div>
 204 </li>
 205 <li class="level1"><div class="li"> SMT electrolytics are designated by can diameter in 1/10 mm: SME33, SME43, SME53, SME66, SME84, SME104.</div>
 206 </li>
 207 </ul>
 208
 209 </div>
 210 <!-- EDIT8 SECTION "Passive SMT components" [6623-] --></body>
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