2 # Generic thermal sysfs drivers configuration
6 tristate "Generic Thermal sysfs driver"
8 Generic Thermal Sysfs driver offers a generic mechanism for
9 thermal management. Usually it's made up of one or more thermal
10 zone and cooling device.
11 Each thermal zone contains its own temperature, trip points,
13 All platforms with ACPI thermal support can use this driver.
14 If you want this support, you should say Y or M here.
18 config THERMAL_STATISTICS
19 bool "Thermal state transition statistics"
21 Export thermal state transition statistics information through sysfs.
25 config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
26 int "Emergency poweroff delay in milli-seconds"
30 Thermal subsystem will issue a graceful shutdown when
31 critical temperatures are reached using orderly_poweroff(). In
32 case of failure of an orderly_poweroff(), the thermal emergency
33 poweroff kicks in after a delay has elapsed and shuts down the system.
34 This config is number of milliseconds to delay before emergency
35 poweroff kicks in. Similarly to the critical trip point,
36 the delay should be carefully profiled so as to give adequate
37 time for orderly_poweroff() to finish on regular execution.
38 If set to 0 emergency poweroff will not be supported.
44 prompt "Expose thermal sensors as hwmon device"
45 depends on HWMON=y || HWMON=THERMAL
48 In case a sensor is registered with the thermal
49 framework, this option will also register it
50 as a hwmon. The sensor will then have the common
51 hwmon sysfs interface.
53 Say 'Y' here if you want all thermal sensors to
54 have hwmon sysfs interface too.
58 prompt "APIs to parse thermal data out of device tree"
62 This options provides helpers to add the support to
63 read and parse thermal data definitions out of the
66 Say 'Y' here if you need to build thermal infrastructure
69 config THERMAL_WRITABLE_TRIPS
70 bool "Enable writable trip points"
72 This option allows the system integrator to choose whether
73 trip temperatures can be changed from userspace. The
74 writable trips need to be specified when setting up the
75 thermal zone but the choice here takes precedence.
77 Say 'Y' here if you would like to allow userspace tools to
78 change trip temperatures.
81 prompt "Default Thermal governor"
82 default THERMAL_DEFAULT_GOV_STEP_WISE
84 This option sets which thermal governor shall be loaded at
85 startup. If in doubt, select 'step_wise'.
87 config THERMAL_DEFAULT_GOV_STEP_WISE
89 select THERMAL_GOV_STEP_WISE
91 Use the step_wise governor as default. This throttles the
92 devices one step at a time.
94 config THERMAL_DEFAULT_GOV_FAIR_SHARE
96 select THERMAL_GOV_FAIR_SHARE
98 Use the fair_share governor as default. This throttles the
99 devices based on their 'contribution' to a zone. The
100 contribution should be provided through platform data.
102 config THERMAL_DEFAULT_GOV_USER_SPACE
104 select THERMAL_GOV_USER_SPACE
106 Select this if you want to let the user space manage the
109 config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
110 bool "power_allocator"
111 select THERMAL_GOV_POWER_ALLOCATOR
113 Select this if you want to control temperature based on
114 system and device power allocation. This governor can only
115 operate on cooling devices that implement the power API.
119 config THERMAL_GOV_FAIR_SHARE
120 bool "Fair-share thermal governor"
122 Enable this to manage platform thermals using fair-share governor.
124 config THERMAL_GOV_STEP_WISE
125 bool "Step_wise thermal governor"
127 Enable this to manage platform thermals using a simple linear
130 config THERMAL_GOV_BANG_BANG
131 bool "Bang Bang thermal governor"
134 Enable this to manage platform thermals using bang bang governor.
136 Say 'Y' here if you want to use two point temperature regulation
137 used for fans without throttling. Some fan drivers depend on this
138 governor to be enabled (e.g. acerhdf).
140 config THERMAL_GOV_USER_SPACE
141 bool "User_space thermal governor"
143 Enable this to let the user space manage the platform thermals.
145 config THERMAL_GOV_POWER_ALLOCATOR
146 bool "Power allocator thermal governor"
148 Enable this to manage platform thermals by dynamically
149 allocating and limiting power to devices.
152 bool "generic cpu cooling support"
154 depends on THERMAL_OF
156 This implements the generic cpu cooling mechanism through frequency
157 reduction. An ACPI version of this already exists
158 (drivers/acpi/processor_thermal.c).
159 This will be useful for platforms using the generic thermal interface
160 and not the ACPI interface.
162 If you want this support, you should say Y here.
165 bool "Generic clock cooling support"
166 depends on COMMON_CLK
169 This entry implements the generic clock cooling mechanism through
170 frequency clipping. Typically used to cool off co-processors. The
171 device that is configured to use this cooling mechanism will be
172 controlled to reduce clock frequency whenever temperature is high.
174 config DEVFREQ_THERMAL
175 bool "Generic device cooling support"
176 depends on PM_DEVFREQ
179 This implements the generic devfreq cooling mechanism through
180 frequency reduction for devices using devfreq.
182 This will throttle the device by limiting the maximum allowed DVFS
183 frequency corresponding to the cooling level.
185 In order to use the power extensions of the cooling device,
186 devfreq should use the simple_ondemand governor.
188 If you want this support, you should say Y here.
190 config THERMAL_EMULATION
191 bool "Thermal emulation mode support"
193 Enable this option to make a emul_temp sysfs node in thermal zone
194 directory to support temperature emulation. With emulation sysfs node,
195 user can manually input temperature and test the different trip
196 threshold behaviour for simulation purpose.
198 WARNING: Be careful while enabling this option on production systems,
199 because userland can easily disable the thermal policy by simply
200 flooding this sysfs node with low temperature values.
203 tristate "Hisilicon thermal driver"
204 depends on ARCH_HISI || COMPILE_TEST
209 Enable this to plug hisilicon's thermal sensor driver into the Linux
210 thermal framework. cpufreq is used as the cooling device to throttle
211 CPUs when the passive trip is crossed.
214 tristate "Temperature sensor driver for Freescale i.MX SoCs"
215 depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST
216 depends on NVMEM || !NVMEM
217 depends on MFD_SYSCON
220 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
221 It supports one critical trip point and one passive trip point. The
222 cpufreq is used as the cooling device to throttle CPUs when the
223 passive trip is crossed.
225 config MAX77620_THERMAL
226 tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
227 depends on MFD_MAX77620
230 Support for die junction temperature warning alarm for Maxim
231 Semiconductor PMIC MAX77620 device. Device generates two alarm
232 interrupts when PMIC die temperature cross the threshold of
233 120 degC and 140 degC.
236 tristate "QorIQ Thermal Monitoring Unit"
237 depends on THERMAL_OF
240 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
241 It supports one critical trip point and one passive trip point. The
242 cpufreq is used as the cooling device to throttle CPUs when the
243 passive trip is crossed.
246 tristate "SPEAr thermal sensor driver"
247 depends on PLAT_SPEAR || COMPILE_TEST
251 Enable this to plug the SPEAr thermal sensor driver into the Linux
254 config ROCKCHIP_THERMAL
255 tristate "Rockchip thermal driver"
256 depends on ARCH_ROCKCHIP || COMPILE_TEST
257 depends on RESET_CONTROLLER
260 Rockchip thermal driver provides support for Temperature sensor
261 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
262 trip point. Cpufreq is used as the cooling device and will throttle
263 CPUs when the Temperature crosses the passive trip point.
266 tristate "Renesas R-Car thermal driver"
267 depends on ARCH_RENESAS || COMPILE_TEST
270 Enable this to plug the R-Car thermal sensor driver into the Linux
273 config RCAR_GEN3_THERMAL
274 tristate "Renesas R-Car Gen3 thermal driver"
275 depends on ARCH_RENESAS || COMPILE_TEST
279 Enable this to plug the R-Car Gen3 thermal sensor driver into the Linux
282 config KIRKWOOD_THERMAL
283 tristate "Temperature sensor on Marvell Kirkwood SoCs"
284 depends on MACH_KIRKWOOD || COMPILE_TEST
288 Support for the Kirkwood thermal sensor driver into the Linux thermal
289 framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
292 tristate "Temperature sensor on Marvell Dove SoCs"
293 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
297 Support for the Dove thermal sensor driver in the Linux thermal
300 config DB8500_THERMAL
301 tristate "DB8500 thermal management"
302 depends on MFD_DB8500_PRCMU
305 Adds DB8500 thermal management implementation according to the thermal
306 management framework. A thermal zone with several trip points will be
307 created. Cooling devices can be bound to the trip points to cool this
308 thermal zone if trip points reached.
310 config ARMADA_THERMAL
311 tristate "Marvell EBU Armada SoCs thermal management"
312 depends on ARCH_MVEBU || COMPILE_TEST
316 Enable this option if you want to have support for thermal management
317 controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
319 config DA9062_THERMAL
320 tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
321 depends on MFD_DA9062 || COMPILE_TEST
324 Enable this for the Dialog Semiconductor thermal sensor driver.
325 This will report PMIC junction over-temperature for one thermal trip
327 Compatible with the DA9062 and DA9061 PMICs.
329 config INTEL_POWERCLAMP
330 tristate "Intel PowerClamp idle injection driver"
333 depends on CPU_SUP_INTEL
335 Enable this to enable Intel PowerClamp idle injection driver. This
336 enforce idle time which results in more package C-state residency. The
337 user interface is exposed via generic thermal framework.
339 config X86_PKG_TEMP_THERMAL
340 tristate "X86 package temperature thermal driver"
341 depends on X86_THERMAL_VECTOR
342 select THERMAL_GOV_USER_SPACE
343 select THERMAL_WRITABLE_TRIPS
346 Enable this to register CPU digital sensor for package temperature as
347 thermal zone. Each package will have its own thermal zone. There are
348 two trip points which can be set by user to get notifications via thermal
349 notification methods.
351 config INTEL_SOC_DTS_IOSF_CORE
353 depends on X86 && PCI
356 This is becoming a common feature for Intel SoCs to expose the additional
357 digital temperature sensors (DTSs) using side band interface (IOSF). This
358 implements the common set of helper functions to register, get temperature
359 and get/set thresholds on DTSs.
361 config INTEL_SOC_DTS_THERMAL
362 tristate "Intel SoCs DTS thermal driver"
363 depends on X86 && PCI && ACPI
364 select INTEL_SOC_DTS_IOSF_CORE
365 select THERMAL_WRITABLE_TRIPS
367 Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
368 temperature sensor (DTS). These SoCs have two additional DTSs in
369 addition to DTSs on CPU cores. Each DTS will be registered as a
370 thermal zone. There are two trip points. One of the trip point can
371 be set by user mode programs to get notifications via Linux thermal
372 notification methods.The other trip is a critical trip point, which
373 was set by the driver based on the TJ MAX temperature.
375 config INTEL_QUARK_DTS_THERMAL
376 tristate "Intel Quark DTS thermal driver"
377 depends on X86_INTEL_QUARK
379 Enable this to register Intel Quark SoC (e.g. X1000) platform digital
380 temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
381 The DTS will be registered as a thermal zone. There are two trip points:
382 hot & critical. The critical trip point default value is set by
383 underlying BIOS/Firmware.
385 menu "ACPI INT340X thermal drivers"
386 source drivers/thermal/int340x_thermal/Kconfig
389 config INTEL_BXT_PMIC_THERMAL
390 tristate "Intel Broxton PMIC thermal driver"
391 depends on X86 && INTEL_SOC_PMIC_BXTWC && REGMAP
393 Select this driver for Intel Broxton PMIC with ADC channels monitoring
394 system temperature measurements and alerts.
395 This driver is used for monitoring the ADC channels of PMIC and handles
396 the alert trip point interrupts and notifies the thermal framework with
397 the trip point and temperature details of the zone.
399 config INTEL_PCH_THERMAL
400 tristate "Intel PCH Thermal Reporting Driver"
401 depends on X86 && PCI
403 Enable this to support thermal reporting on certain intel PCHs.
404 Thermal reporting device will provide temperature reading,
405 programmable trip points and other information.
408 tristate "Temperature sensor driver for mediatek SoCs"
409 depends on ARCH_MEDIATEK || COMPILE_TEST
411 depends on NVMEM || NVMEM=n
412 depends on RESET_CONTROLLER
415 Enable this option if you want to have support for thermal management
416 controller present in Mediatek SoCs
418 menu "Broadcom thermal drivers"
419 depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || COMPILE_TEST
420 source "drivers/thermal/broadcom/Kconfig"
423 menu "Texas Instruments thermal drivers"
424 depends on ARCH_HAS_BANDGAP || COMPILE_TEST
426 source "drivers/thermal/ti-soc-thermal/Kconfig"
429 menu "Samsung thermal drivers"
430 depends on ARCH_EXYNOS || COMPILE_TEST
431 source "drivers/thermal/samsung/Kconfig"
434 menu "STMicroelectronics thermal drivers"
435 depends on ARCH_STI && OF
436 source "drivers/thermal/st/Kconfig"
440 tristate "Tango thermal management"
441 depends on ARCH_TANGO || COMPILE_TEST
443 Enable the Tango thermal driver, which supports the primitive
444 temperature sensor embedded in Tango chips since the SMP8758.
445 This sensor only generates a 1-bit signal to indicate whether
446 the die temperature exceeds a programmable threshold.
448 source "drivers/thermal/tegra/Kconfig"
450 config QCOM_SPMI_TEMP_ALARM
451 tristate "Qualcomm SPMI PMIC Temperature Alarm"
452 depends on OF && SPMI && IIO
455 This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
456 PMIC devices. It shows up in sysfs as a thermal sensor with multiple
457 trip points. The temperature reported by the thermal sensor reflects the
458 real time die temperature if an ADC is present or an estimate of the
459 temperature based upon the over temperature stage value.
461 config GENERIC_ADC_THERMAL
462 tristate "Generic ADC based thermal sensor"
465 This enabled a thermal sysfs driver for the temperature sensor
466 which is connected to the General Purpose ADC. The ADC channel
467 is read via IIO framework and the channel information is provided
468 to this driver. This driver reports the temperature by reading ADC
469 channel and converts it to temperature based on lookup table.
471 menu "Qualcomm thermal drivers"
472 depends on (ARCH_QCOM && OF) || COMPILE_TEST
473 source "drivers/thermal/qcom/Kconfig"
476 config ZX2967_THERMAL
477 tristate "Thermal sensors on zx2967 SoC"
478 depends on ARCH_ZX || COMPILE_TEST
480 Enable the zx2967 thermal sensors driver, which supports
481 the primitive temperature sensor embedded in zx2967 SoCs.
482 This sensor generates the real time die temperature.
484 config UNIPHIER_THERMAL
485 tristate "Socionext UniPhier thermal driver"
486 depends on ARCH_UNIPHIER || COMPILE_TEST
487 depends on THERMAL_OF && MFD_SYSCON
489 Enable this to plug in UniPhier on-chip PVT thermal driver into the
490 thermal framework. The driver supports CPU thermal zone temperature
491 reporting and a couple of trip points.