2 # Generic thermal sysfs drivers configuration
6 tristate "Generic Thermal sysfs driver"
8 Generic Thermal Sysfs driver offers a generic mechanism for
9 thermal management. Usually it's made up of one or more thermal
10 zone and cooling device.
11 Each thermal zone contains its own temperature, trip points,
13 All platforms with ACPI thermal support can use this driver.
14 If you want this support, you should say Y or M here.
20 prompt "Expose thermal sensors as hwmon device"
21 depends on HWMON=y || HWMON=THERMAL
24 In case a sensor is registered with the thermal
25 framework, this option will also register it
26 as a hwmon. The sensor will then have the common
27 hwmon sysfs interface.
29 Say 'Y' here if you want all thermal sensors to
30 have hwmon sysfs interface too.
34 prompt "APIs to parse thermal data out of device tree"
38 This options provides helpers to add the support to
39 read and parse thermal data definitions out of the
42 Say 'Y' here if you need to build thermal infrastructure
46 prompt "Default Thermal governor"
47 default THERMAL_DEFAULT_GOV_STEP_WISE
49 This option sets which thermal governor shall be loaded at
50 startup. If in doubt, select 'step_wise'.
52 config THERMAL_DEFAULT_GOV_STEP_WISE
54 select THERMAL_GOV_STEP_WISE
56 Use the step_wise governor as default. This throttles the
57 devices one step at a time.
59 config THERMAL_DEFAULT_GOV_FAIR_SHARE
61 select THERMAL_GOV_FAIR_SHARE
63 Use the fair_share governor as default. This throttles the
64 devices based on their 'contribution' to a zone. The
65 contribution should be provided through platform data.
67 config THERMAL_DEFAULT_GOV_USER_SPACE
69 select THERMAL_GOV_USER_SPACE
71 Select this if you want to let the user space manage the
76 config THERMAL_GOV_FAIR_SHARE
77 bool "Fair-share thermal governor"
79 Enable this to manage platform thermals using fair-share governor.
81 config THERMAL_GOV_STEP_WISE
82 bool "Step_wise thermal governor"
84 Enable this to manage platform thermals using a simple linear
87 config THERMAL_GOV_BANG_BANG
88 bool "Bang Bang thermal governor"
91 Enable this to manage platform thermals using bang bang governor.
93 Say 'Y' here if you want to use two point temperature regulation
94 used for fans without throttling. Some fan drivers depend on this
95 governor to be enabled (e.g. acerhdf).
97 config THERMAL_GOV_USER_SPACE
98 bool "User_space thermal governor"
100 Enable this to let the user space manage the platform thermals.
103 bool "generic cpu cooling support"
105 depends on THERMAL_OF
107 This implements the generic cpu cooling mechanism through frequency
108 reduction. An ACPI version of this already exists
109 (drivers/acpi/processor_thermal.c).
110 This will be useful for platforms using the generic thermal interface
111 and not the ACPI interface.
113 If you want this support, you should say Y here.
116 bool "Generic clock cooling support"
117 depends on COMMON_CLK
120 This entry implements the generic clock cooling mechanism through
121 frequency clipping. Typically used to cool off co-processors. The
122 device that is configured to use this cooling mechanism will be
123 controlled to reduce clock frequency whenever temperature is high.
125 If you want this support, you should say Y here.
127 config THERMAL_EMULATION
128 bool "Thermal emulation mode support"
130 Enable this option to make a emul_temp sysfs node in thermal zone
131 directory to support temperature emulation. With emulation sysfs node,
132 user can manually input temperature and test the different trip
133 threshold behaviour for simulation purpose.
135 WARNING: Be careful while enabling this option on production systems,
136 because userland can easily disable the thermal policy by simply
137 flooding this sysfs node with low temperature values.
140 tristate "Temperature sensor driver for Freescale i.MX SoCs"
141 depends on CPU_THERMAL
142 depends on MFD_SYSCON
145 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
146 It supports one critical trip point and one passive trip point. The
147 cpufreq is used as the cooling device to throttle CPUs when the
148 passive trip is crossed.
151 bool "SPEAr thermal sensor driver"
152 depends on PLAT_SPEAR
155 Enable this to plug the SPEAr thermal sensor driver into the Linux
158 config ROCKCHIP_THERMAL
159 tristate "Rockchip thermal driver"
160 depends on ARCH_ROCKCHIP
161 depends on RESET_CONTROLLER
163 Rockchip thermal driver provides support for Temperature sensor
164 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
165 trip point. Cpufreq is used as the cooling device and will throttle
166 CPUs when the Temperature crosses the passive trip point.
169 tristate "Renesas R-Car thermal driver"
170 depends on ARCH_SHMOBILE || COMPILE_TEST
173 Enable this to plug the R-Car thermal sensor driver into the Linux
176 config KIRKWOOD_THERMAL
177 tristate "Temperature sensor on Marvell Kirkwood SoCs"
178 depends on MACH_KIRKWOOD
181 Support for the Kirkwood thermal sensor driver into the Linux thermal
182 framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
185 tristate "Temperature sensor on Marvell Dove SoCs"
186 depends on ARCH_DOVE || MACH_DOVE
189 Support for the Dove thermal sensor driver in the Linux thermal
192 config DB8500_THERMAL
193 bool "DB8500 thermal management"
194 depends on ARCH_U8500
197 Adds DB8500 thermal management implementation according to the thermal
198 management framework. A thermal zone with several trip points will be
199 created. Cooling devices can be bound to the trip points to cool this
200 thermal zone if trip points reached.
202 config ARMADA_THERMAL
203 tristate "Armada 370/XP thermal management"
204 depends on ARCH_MVEBU
207 Enable this option if you want to have support for thermal management
208 controller present in Armada 370 and Armada XP SoC.
210 config TEGRA_SOCTHERM
211 tristate "Tegra SOCTHERM thermal management"
212 depends on ARCH_TEGRA
214 Enable this option for integrated thermal management support on NVIDIA
215 Tegra124 systems-on-chip. The driver supports four thermal zones
216 (CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal
217 zones to manage temperatures. This option is also required for the
218 emergency thermal reset (thermtrip) feature to function.
220 config DB8500_CPUFREQ_COOLING
221 tristate "DB8500 cpufreq cooling"
222 depends on ARCH_U8500
223 depends on CPU_THERMAL
226 Adds DB8500 cpufreq cooling devices, and these cooling devices can be
227 bound to thermal zone trip points. When a trip point reached, the
228 bound cpufreq cooling device turns active to set CPU frequency low to
231 config INTEL_POWERCLAMP
232 tristate "Intel PowerClamp idle injection driver"
235 depends on CPU_SUP_INTEL
237 Enable this to enable Intel PowerClamp idle injection driver. This
238 enforce idle time which results in more package C-state residency. The
239 user interface is exposed via generic thermal framework.
241 config X86_PKG_TEMP_THERMAL
242 tristate "X86 package temperature thermal driver"
243 depends on X86_THERMAL_VECTOR
244 select THERMAL_GOV_USER_SPACE
247 Enable this to register CPU digital sensor for package temperature as
248 thermal zone. Each package will have its own thermal zone. There are
249 two trip points which can be set by user to get notifications via thermal
250 notification methods.
252 config INTEL_SOC_DTS_THERMAL
253 tristate "Intel SoCs DTS thermal driver"
254 depends on X86 && IOSF_MBI
256 Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
257 temperature sensor (DTS). These SoCs have two additional DTSs in
258 addition to DTSs on CPU cores. Each DTS will be registered as a
259 thermal zone. There are two trip points. One of the trip point can
260 be set by user mode programs to get notifications via Linux thermal
261 notification methods.The other trip is a critical trip point, which
262 was set by the driver based on the TJ MAX temperature.
264 config INT340X_THERMAL
265 tristate "ACPI INT340X thermal drivers"
266 depends on X86 && ACPI
267 select THERMAL_GOV_USER_SPACE
268 select ACPI_THERMAL_REL
271 Newer laptops and tablets that use ACPI may have thermal sensors and
272 other devices with thermal control capabilities outside the core
273 CPU/SOC, for thermal safety reasons.
274 They are exposed for the OS to use via the INT3400 ACPI device object
275 as the master, and INT3401~INT340B ACPI device objects as the slaves.
276 Enable this to expose the temperature information and cooling ability
277 from these objects to userspace via the normal thermal framework.
278 This means that a wide range of applications and GUI widgets can show
279 the information to the user or use this information for making
280 decisions. For example, the Intel Thermal Daemon can use this
281 information to allow the user to select his laptop to run without
284 config ACPI_THERMAL_REL
288 menu "Texas Instruments thermal drivers"
289 source "drivers/thermal/ti-soc-thermal/Kconfig"
292 menu "Samsung thermal drivers"
293 depends on ARCH_EXYNOS
294 source "drivers/thermal/samsung/Kconfig"
297 menu "STMicroelectronics thermal drivers"
298 depends on ARCH_STI && OF
299 source "drivers/thermal/st/Kconfig"